- 您现在的位置：买卖IC网 > Sheet目录505 > RXM-GPS-SG-T (Linx Technologies Inc)GPS MODULE SMD SIRF
PAD LAYOUT
The following pad layout diagram is designed to facilitate both hand and
automated assembly.
AUTOMATED ASSEMBLY
For high-volume assembly, most users will want to auto-place the modules. The
modules have been designed to maintain compatibility with reflow processing
techniques; however, due to their hybrid nature, certain aspects of the assembly
0.512
(13.00)
0.020
(0.50)
0.028
(0.70)
0.036
(0.92)
process are far more critical than for other component types.
Following are brief discussions of the three primary areas where caution must be
observed.
Reflow Temperature Profile
The single most critical stage in the automated assembly process is the reflow
0.050
(1.27)
0.036
(0.92)
0.050
(1.27)
0.045
(1.15)
stage. The reflow profile below should not be exceeded, since excessive
temperatures or transport times during reflow will irreparably damage the
modules. Assembly personnel will need to pay careful attention to the oven’s
profile to ensure that it meets the requirements necessary to successfully reflow
Figure 9: Recommended PCB Layout
PRODUCTION GUIDELINES
all components while still remaining within the limits mandated by the modules.
The figure below shows the recommended reflow oven profile for the modules.
The modules are housed in a hybrid SMD package that supports hand and
automated assembly techniques. Since the modules contain discrete
components internally, the assembly procedures are critical to ensuring the
reliable function of the modules. The following procedures should be reviewed
with and practiced by all assembly personnel.
HAND ASSEMBLY
Pads located on the bottom of the
Soldering Iron
module are the primary mounting
220°C
Prehe a t: 150~200°C
Pe a k: 240+/-0.5°C
He a ting R a te:
2~3°C/ s ec
25~35 s ec
surface. Since these pads are
inaccessible during mounting,
Tip
He a ting R a te:
2~4°C/ s ec
120~150 s ec
60~80 s ec
castellations that run up the side of
the module have been provided to
facilitate solder wicking to the
Solder
module’s underside. This allows for
very quick hand soldering for
prototyping and small volume
PCB Pads
Castellations
30°C
Time ( S econd s )
production.
Figure 10: Soldering Technique
Figure 11: Maximum Reflow Profile
If the recommended pad guidelines have been followed, the pads will protrude
slightly past the edge of the module. Use a fine soldering tip to heat the board
pad and the castellation, then introduce solder to the pad at the module’s edge.
The solder will wick underneath the module, providing reliable attachment. Tack
one module corner first and then work around the device, taking care not to
exceed the times listed below.
Absolute Maximum Solder Times
Hand-Solder Temp. TX +225°C for 10 Seconds
Hand-Solder Temp. RX +225°C for 10 Seconds
Recommended Solder Melting Point +180°C
Reflow Oven: +240°C Max. (See adjoining diagram)
Page 3 0
Shock During Reflow Transport
Since some internal module components may reflow along with the components
placed on the board being assembled, it is imperative that the modules not be
subjected to shock or vibration during the time solder is liquid. Should a shock
be applied, some internal components could be lifted from their pads, causing
the module to not function properly.
Washability
The modules are not hermetically sealed. Linx recommends wash-free
manufacturing; however, the modules can be subjected to a wash cycle provided
that a drying time is allowed prior to applying electrical power to the modules.
The drying time should be sufficient to allow any moisture that may have
migrated into the module to evaporate, thus eliminating the potential for shorting
damage during power-up or testing. If the wash contains contaminants, the
performance may be adversely affected, even after drying.
Page 3 1
发布紧急采购，3分钟左右您将得到回复。
相关PDF资料
RXM-GPS-SR-T
GPS MODULE SMD SIRF W/ANT
RZE002P02TL
MOSFET P-CH 20V 200MA EMT3
RZF020P01TL
MOSFET P-CH 12V 2A TUMT3
RZF030P01TL
MOSFET P-CH 12V 3A TUMT3
RZM002P02T2L
MOSFET P-CH 20V 0.2A UMT6
RZQ045P01TR
MOSFET P-CH 12V 4.5A TSMT6
RZQ050P01TR
MOSFET P-CH 12V 5A TSMT6
RZR020P01TL
MOSFET P-CH 12V 2A TSMT3
相关代理商/技术参数
RXM-GPS-SR-B
功能描述:GPS模块 GPS Receiver with Integrated Antenna
RoHS:否 制造商:Linx Technologies 频带:1.575 GHz 通道数量:20 首次定位时间（冷启动）:35 s 获取敏感性:- 144 dBm 水平位置精确度:10 m 工作电源电压:3 V to 4.2 V 工作电源电流:46 mA 接口类型:Serial 最大工作温度:+ 85 C 安装风格:SMD/SMT 尺寸:15 mm x 13 mm x 2.2 mm
RXM-GPS-SR-T
功能描述:GPS模块 GPS Receiver with Integrated Antenna
RoHS:否 制造商:Linx Technologies 频带:1.575 GHz 通道数量:20 首次定位时间（冷启动）:35 s 获取敏感性:- 144 dBm 水平位置精确度:10 m 工作电源电压:3 V to 4.2 V 工作电源电流:46 mA 接口类型:Serial 最大工作温度:+ 85 C 安装风格:SMD/SMT 尺寸:15 mm x 13 mm x 2.2 mm
RXM-UHF
制造商:RADIOMETRIX 制造商全称:RADIOMETRIX 功能描述:UHF Radio Telemetry Receiver Module
RXP0005
制造商:Panasonic Industrial Company 功能描述:ARM
RXP0014
制造商:Panasonic Industrial Company 功能描述:PULLEY
RXP0015
制造商:Panasonic Industrial Company 功能描述:ROLLER
RXP0016
制造商:Panasonic Industrial Company 功能描述:ROLLER
RXP0016-4
制造商:Panasonic Industrial Company 功能描述:ROLLER